RELIFE RL-402 Solder Paste

The image displays a container of RELIFE RL-402 Solder Paste. This product is a medium-temperature, no-clean solder paste commonly used for electronic repairs and BGA reballing. 

• Product Name: RELIFE RL-402 Solder Paste 

• Melting Point:

183∘C

183∘C

• Alloy Composition: Sn63/Pb37 (Tin 63%, Lead 37%) 

• Key Features: No-clean formula, excellent adhesion, and high viscosity suitable for precise application in mobile phone and PCB repairs